3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
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sku: 4000182629808
$14.17
Shipping from: China
   Technical Details
Brand Name: MECHANIC
Model Number: 3D X
Particle Size: 1-10μm
   Price history chart & currency exchange rate

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