2pcs/lot BGA reballing reball stencil for xiaomi hongmi note3 CPU MSM8956 RF5418 WCN3615 BQ74296M WCN3680 PM8952 PMI8952 PM8956

2pcs/lot BGA reballing reball stencil for xiaomi hongmi note3 CPU MSM8956 RF5418 WCN3615 BQ74296M WCN3680 PM8952 PMI8952 PM8956
sku: 32778821872
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.00
Shipping from: China
   Technical Details
Application: Mobile Phone
Brand Name: mantong
Condition: New
Dissipation Power: BGA Reball Stencil
is customized: Yes
Model Number: MSM8956 RF5418 WCN3615 BQ74296M WCN3680 PM8952 PMI8952 PM8956
Operating Temperature: BGA Reball Stencil
Package: SMD
Supply Voltage: BGA Reball Stencil
Type: BGA Reball Stencil
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