12pcs/lot IC Chip BGA Reballing Stencil Kits Set Solder template for samsung Galaxy S3 S4 S5 S6 S7 S8 NOTE3/4/5/6 high quality

12pcs/lot IC Chip BGA Reballing Stencil Kits Set Solder template for samsung Galaxy S3 S4 S5 S6 S7 S8 NOTE3/4/5/6 high quality
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sku: 32958949631
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$8.00
Shipping from: China
   Technical Details
Brand Name: HDCSUN
Model: for samsung
Model Number: BGA Reballing Stencil
Package Size: 27cm x 23cm x 5cm (10.63in x 9.06in x 1.97in)
Package Weight: 0.16kg (0.35lb.)
Particle Size: 5-15μm
Unit Type: piece
   Price history chart & currency exchange rate

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