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Universal QU1 BGA Reballing Stencil CPU Qualcomm MSM Series Reballing MSM8996 8976 8992 8953 MSM8994 SDM660 0.12MM Amaoe
sku: 1005006138395152
$18.20
-1%
$18.05
715.00 грн.
+2%
~
730.00 грн.
$18.05, $1.00 = 40.32 грн.
1,690.00 руб.
-5%
~
1,600.00 руб.
$18.05, $1.00 = 88.82 руб.
€ 17.00
-2%
~
€ 16.60
$18.05, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
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Amaoe QU6 BGA Reballing Stencil For MDM6600 MDM9600 QSC6270 Qualcomm CPU With Baseband 0.12mm Chip IC Repair Steel Mesh
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AMAOE U6 Phone CPU Tin Planting Platform Set for MSM8994 MSM8996 CPU 0.12mm BGA Reballing Steel Mesh Kit
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10pcs/set Amaoe BGA Reballing Stencil kit for MTK Qualcomm CPU Series Xiaomi Huawei MU1 MU2 MU3 MQ1 MQ2 QU1 QU2 QU3 QU4 QU5
+2%
25%
$7.10
AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
-2%
22%
$13.99
AMAOE QU1-8 MU1-5 MQ1-5 RAM1 RAM2 BGA Reballing Stencil for MTK MU Qualcomm CPU Chip Tin Planting Steel Mesh
20%
$7.06
Amaoe QU1-8 BGA Reballing Stencil MTK Qualcomm SDM845 SM8350 SDM888 MSM8998 SM/SDM/MSM 888 CPU RAM Phone Repair Steel Mesh
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$7.00
Amaoe QU6 BGA Reballing Template Stencil For MDM6600 MDM9600 QSC6270 Qualcomm CPU Baseband Chip IC 0.12mm Steel Mesh
17%
$15.80
Amaoe Mbga-B5 BGA Reballing Stencil Platform For Android CPU SM8250 MSM8998 MT6891Z SM7225 MSM8937 MSM8994 SDM660 SDM439 MSM8917
16%
$8.58
AMAOE U6 Phone CPU Tin Planting Platform Set for MSM8994 MSM8996 CPU 0.12mm BGA Reballing Steel Mesh Kit
15%
$7.05
Amaoe QU6 BGA Reballing Template Stencil For MDM6600 MDM9600 QSC6270 Qualcomm CPU Baseband Chip IC 0.12mm Steel Mesh
12%
$7.05
AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
11%
$7.39
Amaoe WC1 BGA Reballing Stencil 0.12mm For Qualcomm WCD Audio IC WCN WIFI 9341 3990 Tin Planting Steel Mesh Repair Tool
+1%
10%
$7.06
Amaoe MQ1 2 3 4 5 BGA Reballing Stencil 0.12mm Qualcomm MTK CPU RAM IC Chip Steel Mesh Tin Planting
5%
$6.18
AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
4%
$6.10
AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
1%
$8.80
Amaoe BGA Stencil Reballing Platform kits For Qualcomm CPU MSM8996 MSM8956 MSM8976 MSM8274 MSM8998 MSM8998 RAM 256/366 MSM8674
1%
$6.81
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1%
$6.76
Amaoe MT1 MT2 PM1-3 BGA Reballing Stencil 0.12MM for IC Chip Tin Plant Net for MTK MT Power Qualcomm PM Power
+1%
1%
$7.80
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+1%
1%
$7.06
Amaoe WC1 BGA Reballing Stencil For Qualcomm WCD Audio IC WCN WIFI 9341 3990 Steel Mesh 0.12mm Tin Planting Net
1%
$7.00
Amaoe U6 BGA Reballing Stencil Template Station Kits for MSM8994 MSM8996 Lower Layer CPU RAM Solder Steel Net
1%
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1%
$8.80
Amaoe BGA Stencil Reballing Platform kits For Qualcomm MSM8952 MSM8917 MSM8909 MSM8953 SDM450 MSM8953 MSM8916 MSM8937 SDM660
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0.040, 5.05
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