Stainless Steel BGA Stencil for NOTE4 APQ8084 CPU BGA529 EMCP BGA Reballing 0.12mm Thickness Solder Template
Характеристики
Application: | BGA Stencil for Samsung NOTE4 APQ8084 CPU BGA529 EMCP |
Model Number: | BGA Stencil |
Thickness: | 0.12mm Thickness |
Материал: | Stainless Steel |
График изменения цены & курс обмена валют