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RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin
sku: 1005006400721181
$3.34
130.00 грн.
+4%
~
135.00 грн.
$3.34, $1.00 = 40.50 грн.
306.00 руб.
-2%
~
299.00 руб.
$3.34, $1.00 = 89.66 руб.
~
€ 3.10
$3.34, € 1.00 = $1.08
Shipping from: China
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RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin
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RELIFE RL-404 Lead-free Low Temperature Melting Point 138 Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin
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RELIFE RL-404 Lead-free Low Temperature Melting Point 138 Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin
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RELIFE RL-404 Lead-free Low Temperature Melting Point 138 Degrees Tin Paste for Mobile phone PCB BGA/SMD Template Repair Tin
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RELIFE RL-404 Lead-free Low Temperature Melting Point 138 Degrees Tin Paste Mobile phone PCB BGA/SMD Template Repair Tin
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RELIFE RL-404 Lead-free Low Temperature Melting Point 138 Degrees Tin Paste Mobile phone BGA/SMD PCB Template Repair Tin
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0.065, 3.92
7/.020,645 0=.002,929 1=.003,613/1 2=.002,826/1 3=.001,398/1 4=.000,916/1 5=.005,604/1 6=.000,184/1 7=.006,104/36
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