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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
sku: 1005005721602275
$39.79
1,510.00 грн.
+7%
~
1,620.00 грн.
$39.79, $1.00 = 40.60 грн.
3,720.00 руб.
-5%
~
3,540.00 руб.
$39.79, $1.00 = 88.88 руб.
€ 37.10
-1%
~
€ 36.70
$39.79, € 1.00 = $1.08
Shipping from: China
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
96%
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
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$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
+4%
91%
$40.97
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
88%
$38.57
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
-18%
82%
$37.09
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
-1%
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$41.04
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder For Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
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RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Soldering Template For Kirin Qualcomm Hisilicon Snapdragon IC Chip
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RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
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RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
21%
$42.52
RELIFE Android CPU Tinned with 35PCS Android Series Chip Planting Tin Steel Stencil Set for Qualcomm Snapdragon/Hisilicon Kirin
19%
$47.91
RELIFE RL-044 58PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
-1%
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$39.80
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$26.56
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