JCD 50g Solder Paste Mild Rosin Environmental Soldering Paste Flux PCB IC Parts Welding Soldering Gel Tool for Metalwork

Features Excellent capacity of solder stickiness Excellent Anti wet Capacity Widely used on BGA PGA CSP packages and flip chip operation Suitable for multiple PCB reflow No clean and Lead free for environmental protection Specification FLUX Type RMA 625AVolume 10ccWeight 50gQuantity 1PceIt can be used for rework sphere or pin attachment to BGA PGA and CSP packages and assemble operations such as Flip Chip attachment to PWB substrates It is a necessary and helpful tool in BGA reballing Package Included 1 x JCD 50g Solder PasteDetail Pictures