For Meizu MX4 Series Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate
Описание
1. High temperature resistance, fast and convenient2. This stencil is easy to use no matter you are a new or expert.3. Precise position4. This product is small and strong5. High success rate of planting tin,the solder balls can be formed once after you are proficient
График изменения цены & курс обмена валют
Пользователи также просматривали
56%
$3.20
For Huawei Mate X2 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate
43%
$3.20
For Qualcomm CPU 7 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate
