BGA Reballing Station with 10pcs Steel Template Stencils and 0.6mm Solder Ball Kits

Features Improve the efficiency of ball placement Can be used for all kinds of chip tinning with universal plant tin These stencils can be heated directly were made by good quality steel Operation 1 Place the BGA chip on the already carved chip base 2 Cover the scraped steel mesh use a scraper to evenly scrape the solder paste on the scraping wire and remove the cover 3 Cover the upper and lower ball steel mesh pour the appropriate tin ball and swing the ball fixture in the front and left Wait until there is a tin ball on each steel mesh hole You cant have more or less then remove the cover 4 Place the ball planted chip on a high temperature cloth or other high temperature material to heat the molten tin if it is processed in batches it can be directly reflowed 5 The chip is an electrostatic sensitive component and pay attention to anti static protection during the tinning process Specification Material MetalReballing Station Color SilverMelting Point 100℃ 212℉Leaded Solder Balls 0 6mmAvailable Chip Size 8 50 mm Package includeds 1 x Reballing Station1 x 0 6mm Leaded Solder Balls 1 bottle 1 x 10ml Flux Paste1 x 10mm Tape1 x Brush1 x Wrench1 x Desoldering Wick1 x Solder Ball Scraper10 x Universal Stencils Details pictures