BGA IC Adhesive Removing Liquid Glue Epoxy Remover Cell Phone CPU Chip Cleaner

Features:- It can help you softenremove resinating / sealing glue of chip BGA IC of mobile phones easily.- It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it wont do harm to your circuit board and components.- This is a environment friendly item and its very safe. Doesnt contain any Benzene Coderivative substances with cause leukaemia.How to use:1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.2. Place a plastic bag or film on the top and cover the PCB board.3. Wait approx. 20 minutes4. Redo step 1 to step 3.5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.6. Heat up the chip with a air gun (300 deg.C). The glue in the bottom will get melt and soften by heat;7. To remove the chip with a tweezers or cutter.Caution: This glue removing liquid shall not touch skin, eyes. Please close it after using. If touched by accident, Please wash with water immediately.Specification:Usage: Electronic ComponentsQuantity: 30mlSize Of Box: 3.8cm x 3.7cm x 8.8cm(1cm=0.393Inches)Package includes:1 x Adhesive Removing Liquid1 x User ManualDetails pictures: