Akasa AK-460 Silicone Technology Thermally Compound for CPU Cooler Heat Sink

Specification: 1. Model: AK-460 2. Application: Thermally conductive compound 3. Form: Non-curing 4.Thermal conductivity: 3.3 W/mK 5.Specific gravity: 3.5 6. Operating temperature: -45C to 200C 7. Thermal resistance: 0.16cmC/W @60um BLT 8. Colour: Grey 9. Volume: 3.5g Features: 1. An evolution in silicone technology delivers outstanding thermal performance, Pro-grade silicone technology provides a stable thermal compound which delivers a great thermal performance. Minimised resistance and maximised efficiency truly enables you to get a lot more from your cooler. RoHS compliant. 2. Outstanding performance of heat transfer between CPU and heatsink . 3. Low thermal resistance for heat transfer, 0.16cmC/W @60 um BLT. 4. Maximum thermal conductivity, 3.3W/mK. 5. Electrically non-conductive. 6. Multi-language instructions included. Package included: 1 * Akasa AK-460 Silicone Technology Compound