Qianli Mainboard Middle Layer BGA Reballing Stencil Plant Tin Platform Logic Board Rework Tool for iPhone X XS XSMAX 11 pro max
sku: 4000300578433
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$20.80
Shipping from: China
Technical Details
| Application: | Mainboard Soldering repair |
| Brand Name: | wozniak |
| DIY Supplies: | Electrical |
| Feature: | Phone Repair jig |
| Features: | Motherboard Repair Planting Tin Fixture for ipx xs xsmax |
| For Iphone: | Qianli BGA Reballing Fixture |
| Middle Layer Board: | Middle Layer Board Repairing for iPhone X XS XSMAX |
| Model Number: | QIANLI Middle Layer |
| Package: | Case |
| QIANLI: | X/XS/XR/XS MAX Reballing Kit |
| Size: | 102X54X9.4MM |
| Type: | Phone Repairing Tools |
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