LY R5830C 4500W BGA Reballing Station Hot Air SMD Soldering Machine for Laptop Motherboard Chip Rework Repair
sku: 32865520509
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$1,516.20
Shipping from: China
Technical Details
| BGA chip: | 2*2-80*80mm |
| Dimension: | L535*W650*H600mm |
| is customized: | Yes |
| Minimum chip spacing: | 0.15mm |
| Model Number: | BGA Reballing Station LY R5830C |
| PCB size: | Max 355*335mm Min 50*50 mm |
| Power: | 4500W |
| Power Supply: | AC220V 50/60Hz |
| Top heater: | Hot air 800W |
| Warranty: | One year |
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