Halnziye thermal interface materials(thermal paste,thermal glue,thermal pad) samples gift box package
Technical Details
| Air Volume: | 30CFM |
| Application: | Processor |
| Bearing: | Fluid Bearing |
| Bleed: | <0.05 |
| Brand Name: | HALNZIYE |
| Certificate: | RoHS,CE,SVHC |
| Color: | Grey&white&silver&gold |
| Compatible CPU: | Intel&AMD |
| Dielectric Constant: | >5.1 |
| Fan Size: | no |
| Fan Speed Control: | No RPM |
| Heatsink Material: | Copper & Aluminum |
| Lines: | None |
| Model: | HY400,HY500,HY600,HY700,HY810,HY880 |
| Model Number: | HY880 |
| Name: | thermal interface materials samples box |
| Noise: | no |
| Operation Temperture: | -30~300 degree C |
| Package: | Yes |
| Power: | 2.5W |
| Specific Gravity: | 2.0~3.25g/cm3 |
| Thermal Conductivity: | 1.42~5.8W/m-K |
| Thermal Impedance: | 0.002~0.252 |
| Type: | Conductive Heatsink Plaster |
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