Customize Ceramic Circuit Board Laser Device Alumina Aluminum Nitride Substrate Heat Sink High Thermal Conductivity Thick Gold AlN

Customize Ceramic Circuit Board Laser Device Alumina Aluminum Nitride Substrate Heat Sink High Thermal Conductivity Thick Gold AlN
sku: 944685692869816320
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$53.90
Shipping from: China
   Description
1. Substrate: AlN ceramic; Thermal conductivity: 170 W/(m.K). 2. Metal layer structure: Ti/Cu/Ni/Au with thickness of 0.1 micron, 50 micron, 3 microns and 1 micron, respectively. 3. Use temperature range: - 50degree Celsius~350degree Celsius. 4. The product is widely used in electronic packaging with reliable performance and stable quality.
   Technical Details
item_group_id: 475305082
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