BGA Reballing Stencils for Samsung S7 MSM8996 CPU G9300 G9350 G9308 Solder Template 0.12mm Thickness

BGA Reballing Stencils for Samsung S7 MSM8996 CPU G9300 G9350 G9308 Solder Template 0.12mm Thickness
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sku: 33031519406
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$4.50
Shipping from: China
   Technical Details
Application: BGA Stencil for Samsung S7 MSM8996 CPU G9300 G9350 G9308
Material: Stainless Steel
Model Number: BGA Stencil
Thickness: 0.12mm Thickness
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