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BGA Reballing Stencil Kit for Samsung S9 S9+ Exynos9810 SDM845 CPU BGA Reballing Plate Heat Template 0.12mm
sku: 33025678266
$4.50
171.00 грн.
+4%
~
178.00 грн.
$4.50, $1.00 = 39.55 грн.
421.00 руб.
-1%
~
417.00 руб.
$4.50, $1.00 = 92.68 руб.
~
€ 4.22
$4.50, € 1.00 = $1.07
Shipping from: China
the store does not ship to your country
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0.140, 4.26
6/.053,821 0=.000,853 1=.004,924/1 2=.002,760/1 3=.001,155/1 4=.015,587/1 5=.004,696/1 6=.024,699/36
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