B-320 RFID Die Bonding Machine
sku: 32555355691
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9,900.00
Shipping from: China
Technical Details
| Control Method and Power Supply: | PLC Control, 220VAC |
| Die Bonding Accuracy: | +-20um |
| Die Dimension: | 0.3mm x 0.3mm ~2.5mm x2.5mm,UF, UHF |
| Die Supply: | Tray Plate |
| Heat Pressure Range: | 0.55N~2N ±0.08N |
| Heat Pressure Temperature: | 50~250C ±1C |
| is customized: | Yes |
| Machine Dimension: | L640mm*W460mm*H600mm |
| Machine Weight and Power: | About35kg, 200W |
| Model Number: | B-320 |
| Product Dimension: | Antenna <=120mm x 100mm |
| Type: | Other |
| Vision System: | Vision System:Two (Upper for antenna, Below for Die) |
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