SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X
sku: 1336688
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$9.80
Shipping from: China
   Description
Features High density high impedancePure alloy compositinFine and stickyStannum planting not bubbingSilver containing highlight Model SP XWeight 50gSize 38 x 31 x 35mmMelting Point 158℃Package Included 1 x SP X Middle Layer of BGA Motherboard Special Solder Paste Detail Pictures
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